Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps. (Image courtesy of Amkor Technology, Inc.)
Computer Desktop Encyclopedia
THIS DEFINITION IS FOR PERSONAL USE ONLY
All other reproduction is strictly prohibited without permission from the publisher.
© 1981-2014 The Computer Language Company Inc. All rights reserved.