Dictionary Home »
Images » flip chip images
flip chip images
Wire Bond Vs. Flip Chip
In the wire bond method (top), the die faces up and is attached to the package via wires. The flip chip (bottom) faces down and is typically attached via solder bumps similar to the larger ones that attach BGA packages to the printed circuit board (also shown here). (Image courtesy of Amkor Technology, Inc.)
Computer Desktop Encyclopedia THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.Copyright © 1981-2010 by Computer Language Company Inc. All rights reserved.
More flip chip images
Learn more about flip chip