BGA Solder Balls
These are the undersides of BGA packages showing the solder balls. The small one on the ruler is a µBGA (MicroBGA) chip from Tessera. Using the entire square of the chip package for leads is an advantage of the BGA method. (Image samples courtesy of Amkor Technology, Inc.)
Computer Desktop Encyclopedia THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.Copyright © 1981-2010 by Computer Language Company Inc. All rights reserved.
BGA Package Types
These cross sections show BGA packages in standard and CSP varieties. (Illustration courtesy of Joseph Fjelstad.)
Computer Desktop Encyclopedia THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.Copyright © 1981-2010 by Computer Language Company Inc. All rights reserved.
Computer Desktop Encyclopedia THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.Copyright © 1981-2010 by Computer Language Company Inc. All rights reserved.
Different Contact Types
The solder balls can be made to connect to the printed circuit board using various contact methods as illustrated here. (Illustration courtesy of Joseph Fjelstad.)
Computer Desktop Encyclopedia THIS DEFINITION IS FOR PERSONAL USE ONLY. All other reproduction is strictly prohibited without permission from the publisher.Copyright © 1981-2010 by Computer Language Company Inc. All rights reserved.
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